The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.

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It is only because of our laser processes that efficient series production of new and innovative components and products are made possible.

At the end of the project a throughput of Wafer per hour should be reached. In addition work will directed to efficient protective coatings for the OLEDs as well as to transparent electrical contacts which give added value to the lighting market. Besides the integration of laser processing, also printing and coating techniques can be integrated.

With this certification, we prove our successful quality management and the efficiency of our process chains as well as our efforts to a continuous improvement.

Whether Standard System or Special Solution: We Optimize your Processes!

This immensely helps to reduce ramp-up times in production. From the founding of our company until today we have constantly been able to achieve important milestones: Successful market launch of production systems for the manufacturing of nozzles via excimer-laser We are micromca of the first companies in the world to focus on the use of ultra-short pulse lasers for the processing of materials.

Microdiagnostics and Failure Analysis.

All systems use UV lasers for permanent marking. In a period of 10 years 3D-Micromac AG has carved out a strong position for itself among manufacturers of laser micro-processing systems. We develop processes, machines and turnkey solutions at the highest technical and technological level. More than excimer laser systems produced by 3D-Micromac AG are currently in industrial use. These platforms are open to multiple users and for multiple applications.


More-than-Moore MtMSystem-in-Package SiPas well as 3D high-density integration technologies are a prerequisite for micromad the design of compact microelectronic devices e.

We use cookies to ensure that we give you the best experience on our website. The ever-new technical challenges that make us grow. These proprietary technology innovations are now readily available on a worldwide scale.

As the first stand-alone, ultrashort pulsed laser-based tool for sample preparation, the microPREP systems bring additional unique capabilities, such as enabling large-area and 3D-shape sampling to allow for more comprehensive testing 3f complex structures. The company has grown since then to more than employees today.

The separated cells show a significantly higher mechanical strength, better edge quality and a lower power reduction compared to laser scribing and breaking approaches. The main goal is to separate the cells without inducing damage at the cutting edge. With the provision of the technology for crack-free separation of 3r glass laminates, the 3D-Micromac AG is an important partner in the project.

microPREP – Laser Micromachining – 3D-Micromac AG

Therefore, we are very proud to be certified to the ISO quality standard since Extremely precise positioning systems, innovative beam-delivery concepts as well as numerous process monitoring methods offer the highest possible process reliability and a maximum speed of machining. The certification covers the entire spectrum of development, production, sales and service of our machines, plants and technologies.


This collaboration will strengthen the competitiveness of the semiconductor and system suppliers to design innovative MtM and SiP products in respect to reliability, quality, cost and shorter time to market to ensure leadership in a global perspective.

Our team of experts develop processes, machinery and complete systems at the highest technical and technological level.

As a result of the project, demonstrators are being developed that illustrate the power of the technology. Areas of use include smartphone displays made of chemically or thermally micrkmac glass, camera casings or watch glasses made of sapphire glass, but also LEDs and OLEDs.

Approaches for the further substantial increase of the throughput should be developed with respect to the equipment. Target of this project is to explore and to develop new diagnostic tools and advanced methods for material characterization, defect localization, efficient sample preparation, physical failure analysis techniques and workflows to enable reliable advanced micro-systems based on MtM, SiP, and 3D technologies for European core applications.

We use cookies to ensure that we give you the best experience on our micrmoac. Its high throughput, outstanding edge quality and mm wafer capable platform enables microma true high-volume production process, especially for SiC-based devices. Therefore TLS is a promising approach as TLS dicing works without remove of material and create a smooth cut nearly without deterioration.