n Light Weight. For footnotes refer to the last page. IRHM REF: MIL-PRF- / TOAA. This datasheet has been downloaded. 2N 2NU. JANSR (K RAD(Si)). JANSF (K RAD(Si)). ABSOLUTE MAXIMUM RATINGS (TC = +25°C unless otherwise noted). Parameters / Test. 2N datasheet, 2N pdf, 2N data sheet, datasheet, data sheet, pdf, Microsemi, N-Channel.
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If hermetic seal is required in the group A, subgroup 1 tests, this test shall be repeated, see 4. The number indicates the nominal percentage, by weight, of the component element s see 3. Consists of the tetter M.
2N datasheet & applicatoin notes – Datasheet Archive
For explanation of superscript codes following XXXX. Datasheeet shall be of such a quality as to enable the film resistors to meet ail the requirements of this specification.
H – Solder plated microinch minimum. The use of pure tin datsaheet is not prohibited in the drawing and the package finish is not specified. They are available in widths from 0. DPA report 1 identifies the package as ceramic with no tin platting, see following insert.
SM – I9B2 J. Use of tin plating is prohibited see 6. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden, to Washington Headquarters Services, Directorate for Information Operations and Reports, Jefferson Davis Highway, SuiteArlington, VAand to the Office of Management and Budget, Paperwork Reduction ProjectWashington, DC The thickness shall be 7 62 pm to microinches For glass -to- metal 2j7269 products, all devices with terminals which are soldef dipped to the seal shall pass screen 7 of table IV, appendix E with a sample size of 1 16 pieces no failures allowed c.
TTass 40 HS or 40A, except thickness ol silver dataeheet shall not ba loss than 40 mterelnches. Pure tin may not be used to coat any surface see H 4. Use of tin plating is prohibited as a finish and as an undercoat see 6.
Use of tin-lead finishes are acceptable provided that the minimum lead content is 3 percent. Tin-lead Sn-Pb finishes are acceptable provided that dataeheet minimum lead content is 3 percent see 6.
All copper or copper clad leads that are to be plated with gold or silver must first be coated with a barrier layer to prevent diffusion of the copper through the final lead finish d Silver leads and silver cladding shall contain a minimum of Use of tin-lead Sn-Pb finishes are acceptable provided that the minimum lead content is 3 percent. The type will be defined on the datsaheet sheet.
IRHN7250 MOSFET. Datasheet pdf. Equivalent
The yield rtreoflh, baaed on 2 percent adta, shall be 30, pci arisiman. The wire type is 05, gold plated; 0. No detects are allowed 12 i Ten of the 30 samples are then subjected to the sofcterabdity test No tetocts are altoweo. For further information write for ‘dialog TWC Ferrites can be pressed in block form and then machined into intricate shapes.
Foftowmg too sufder dHi retmning process the etectncai measurements required hi group A subgroup ” pnrcenl screening test Stiafi be repeated on percent of tori lol.
2N Datasheet catalog
DPA report shows a gold finish for both the package and the leads. The final finish for leads see 1. Tin plating is prohibited as a final finish or as an undercoat.
Biro copper wire shall c anfom to soft or datashwet copper wire In accordance with AST Where space is critical, the low profile CLP component should be considered, but at the expense of some reduction in electrical Q.
Drawing number PD defines the material properties of the wire in the following paragraph, 3. The following DPA photograph shows gold plated package and leads. C, C Types A, ft. The lead finish ehaii be designated by a ainple letter aa toilowe: